Electronic assembly having composite electronic contacts for...

Details Electronic assembly having composite electronic contacts for... Electronic assembly having composite electronic contacts for...

2006-05-30

2006-05-30

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S778000, C257S738000, C257S772000, C257S779000, C257S780000, C257S777000, C257S730000

Reexamination Certificate

active

07053491

ABSTRACT:
Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.

REFERENCES:
patent: 3303393 (1967-02-01), Hymes et al.
patent: 5801446 (1998-09-01), DiStefano et al.
patent: 5841198 (1998-11-01), Chia et al.
patent: 5931371 (1999-08-01), Pao et al.
patent: 6002168 (1999-12-01), Bellaar et al.
patent: 6087597 (2000-07-01), Shimada et al.
patent: 6184062 (2001-02-01), Brofman et al.
patent: 6271111 (2001-08-01), Farooq et al.
patent: 6283359 (2001-09-01), Brofman et al.
patent: 6300578 (2001-10-01), Hoffmeyer et al.
patent: 6303408 (2001-10-01), Smith
patent: 6324754 (2001-12-01), DiStefano et al.
patent: 6465747 (2002-10-01), DiStefano et al.
patent: 2001/0015495 (2001-08-01), Brofman et al.
patent: 2002/0041036 (2002-04-01), Smith

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