Electronic assembly including a die having an integrated...

Details Electronic assembly including a die having an integrated... Electronic assembly including a die having an integrated...

2007-01-30

2007-01-30

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Specified wide band gap semiconductor material other than...

Diamond or silicon carbide

C257S103000, C257S713000, C257S678000, C257SE21122, C257SE21568

Reexamination Certificate

active

11050902

ABSTRACT:
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

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