LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package semiconductor device having improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array package stack

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ball grid array package stacking system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Ball grid array package substrates and method of making the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array package that includes a collapsible spacer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array package that includes a collapsible spacer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array package with conductive leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array package with enhanced thermal and electrical cha

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Ball grid array package with improved thermal characteristics

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array package with inexpensive threaded secure locking

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ball grid array package with lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface

Ball grid array package with multiple interposers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package with patterned stiffener layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package with patterned stiffener surface and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array package with separated stiffener layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ball grid array package with shielding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ball grid array package with stacked center pad chips and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array package with supplemental electronic component