Ball grid array package system

Details Ball grid array package system Ball grid array package system

2011-01-04

2011-01-04

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S711000, C257S720000, C438S121000, C438S122000, C438S125000

Reexamination Certificate

active

07863732

ABSTRACT:
A ball grid array package system comprising: forming a package base including: fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader, mounting a substrate around the integrated circuit die, and coupling an electrical interconnect between the integrated circuit die and the substrate; and coupling a second integrated circuit package to the substrate through the access port.

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