Ball grid array package having through-holes disposed in the sub

Details Ball grid array package having through-holes disposed in the sub Ball grid array package having through-holes disposed in the sub

1997-08-13

2000-09-19

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257698, 257738, 257773, 257780, 257786, H01L 2318

Patent

active

061216860

ABSTRACT:
Disclosed is a semiconductor device for improving a resistance against barrel cracks of an insulating substrate on which a semiconductor chip is mounted, thereby enhancing a reliability of the semiconductor device. A plurality of through-holes provided in a BGA substrate for electrically connecting electrodes of a semiconductor chip to packaging electrodes are arranged inside a region of the BGA substrate in which the semiconductor chip is mounted. When the semiconductor device undergoes temperature changes, a larger extension/contraction force is applied to the lower portion of the BGA substrate as compared with the upper portion thereof, and such an expansion/contraction force becomes larger at a position more apart from the center of the BGA substrate. As a result, a through-hole at a position more apart from the BGA substrate is applied to a larger stress. However, since the plurality of through-holes are arranged inside the region of the BGA substrate in which the semiconductor chip is mounted, the stress applied to each through-hole can be reduced. This is effective to suppress occurrence of barrel cracks.

REFERENCES:
patent: 5598036 (1997-01-01), Ho
patent: 5708567 (1998-01-01), Shim et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5894410 (1999-04-01), Barrow

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