Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2005-04-12
2005-04-12
Trinh, Michael (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S678000, C257S738000, C257S773000, C257S780000, C257S787000
Reexamination Certificate
active
06879039
ABSTRACT:
An electrically and mechanically enhanced die-down tape substrate ball grid array (BGA) package substrate is described. An IC package includes a substrate that has a first surface. The first surface has a central opening. A stiffener/heat spreader has a first surface. The first surface of the stiffener has a central ground ring. The first surface of the stiffener is coupled to a second surface of the substrate. The central opening has an edge. The edge includes at least one of the following: (a) a protruding edge portion that extends across at least a portion of the central ground ring, (b) a recessed edge portion that exposes a portion of the central ground ring, or (c) a hole proximate to the edge, wherein the hole exposes a portion of the central ground ring.
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Khan Reza-ur Rahman
Zhong Chong Hua
Broadcom Corporation
Soward Ida M.
Sterne Kessler Goldstein & Fox P.L.L.C.
Trinh Michael
LandOfFree
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