Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface
Reexamination Certificate
2005-03-01
2005-03-01
Lee, Eddie (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
With textured surface
C257S701000, C257S702000, C257S669000, C257S737000, C257S747000, C257S717000, C257S780000, C257S738000, C257S712000, C257S774000, C257S779000, C257S684000, C257S693000, C257S668000, C257S704000, C257S695000, C257S697000, C257S696000, C257S675000, C257S666000, C257S706000, C257S687000, C257S700000, C257S676000, C438S108000, C438S122000, C438S015000, C438S025000, C438S026000
Reexamination Certificate
active
06861750
ABSTRACT:
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second surface of the first stiffener is attached to a first surface of a second stiffener to cover an opening through the second stiffener that is open at the first surface and a second surface of the second stiffener. The second surface of the second stiffener is attached to a first surface of a substantially planar substrate that has a plurality of contact pads on the first surface of the substrate. The plurality of contact pads are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate.
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Khan Reza-ur Rahman
Zhao Sam Ziqun
Broadcom Corporation
Im Junghwa
Lee Eddie
Sterne Kessler Goldstein & Fox PLLC
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