Ball grid array package with separated stiffener layer

Details Ball grid array package with separated stiffener layer Ball grid array package with separated stiffener layer

2002-10-31

2009-06-23

Gurley, Lynne (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S701000, C257S702000, C257S737000, C257S669000, C257S747000, C257S717000, C257S780000, C257SE23004, C257SE23026, C257SE23051

Reexamination Certificate

active

07550845

ABSTRACT:
In a ball grid array (BGA) package, a first stiffener is attached to a surface of a substrate. A second stiffener is attached to the surface of the substrate to be co-planar with the first stiffener. The second stiffener is separated from the first stiffener by a channel therebetween. An integrated circuit (IC) die is mounted to a surface of the second stiffener.

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