Ball grid array package stacking system

Details Ball grid array package stacking system Ball grid array package stacking system

2008-06-17

2011-10-18

Zarneke, David (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S706000, C257S713000, C257SE23101, C257SE23141

Reexamination Certificate

active

08039942

ABSTRACT:
A ball grid array package stacking system includes: providing a base substrate; coupling an integrated circuit to the base substrate; coupling a stacking substrate over the base substrate; mounting a heat spreader, having an access port, around the base substrate and the stacking substrate; and coupling a stacked integrated circuit to the stacking substrate through the access port.

REFERENCES:
patent: 6537848 (2003-03-01), Camenforte et al.
patent: 6853070 (2005-02-01), Khan et al.
patent: 6984785 (2006-01-01), Diao et al.
patent: 7315079 (2008-01-01), Zhou et al.
patent: 2006/0103010 (2006-05-01), Kim et al.
patent: 2009/0236733 (2009-09-01), Chow et al.

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