LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device package and method of assembly thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package having a connection substrate with

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package having twice-bent tie bar and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Semiconductor device package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package with base features to reduce...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device package with plural pad lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package with reduced leakage

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Semiconductor device packages having dummy block leads and tie b

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device packaging assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor device tester and method of testing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device using bonding wires of different materials

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Semiconductor device using film carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device using lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor device utilizing a lead on chip structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Semiconductor device which is crack resistant

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Semiconductor device wiring lead frame having resin flow...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor device with a convex heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor device with a film carrier tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor device with a plurality of face to face chips