Semiconductor device with a plurality of face to face chips

Details Semiconductor device with a plurality of face to face chips Semiconductor device with a plurality of face to face chips

1991-09-06

1994-03-22

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

257723, 257737, 257787, H01L 2328

Patent

active

052967379

ABSTRACT:
A semiconductor device comprises a plurality of semiconductor chips; electrodes formed on circuit surfaces of said plurality of semiconductor chips; inner leads made of a metal foil and bonded at first ends thereof to the electrodes, outer leads each having a predetermined surface at a first end thereof bonded to a second end of at least one of the inner leads, and a sealing material sealing said plurality of semiconductor chips, the electrodes, the inner leads, and part of each of the outer leads. The semiconductor chips are laminated in such a manner that those surfaces of the semiconductor chips on which their respective circuits are formed are disposed in facing relation to each other. This provides a semiconductor device which is excellent in assembling efficiency.

REFERENCES:
patent: 3893158 (1975-07-01), Lincoln
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4763188 (1988-08-01), Johnson et al.
patent: 4862322 (1989-08-01), Bickford et al.
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5070390 (1991-12-01), Shimizu

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