Semiconductor device which is crack resistant

Details Semiconductor device which is crack resistant Semiconductor device which is crack resistant

1997-04-10

2000-08-01

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257674, 257735, 257783, 257784, H01L 23495, H01L 2348

Patent

active

060970839

ABSTRACT:
A resin mold type semiconductor device, which is crack resistant and can be made relatively thin, includes a semiconductor chip, a lead member arranged in a manner such that an one side face of a head portion thereof touches a surface of the semiconductor chip, a wire for electrically connecting the surface of the semiconductor chip and another side face of the lead member, an adhesive member for adhering the one side face of the lead member and a peripheral face of the semiconductor chip, and a package for molding the semiconductor chip, a part of the lead, the wire and the adhesive member by synthetic resin. Further, the lead member may be provided with a concave portion in the one side face and possibly also a groove extending from the concave portion to an end of the lead.

REFERENCES:
patent: 4864470 (1989-09-01), Nishio
patent: 4974057 (1990-11-01), Tazima
patent: 5403785 (1995-04-01), Arai et al.
patent: 5670797 (1997-09-01), Okazaki

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