Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2009-01-12
2011-11-01
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S706000, C257S713000, C257SE23039, C257S673000
Reexamination Certificate
active
08049312
ABSTRACT:
A semiconductor die package includes: an assembly including a semiconductor die, a clip structure attached to an upper surface of the semiconductor die, and a heat sink attached to an upper surface of the clip structure; and a molding material partially encapsulating the assembly, wherein an upper surface of the heat sink is exposed through the molding material.
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Herbsommer Juan Alejandro
Lopez Osvaldo J.
Noquil Jonathan A.
Brady III Wade J.
Parekh Nitin
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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