Semiconductor device package and method of assembly thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

Other Related Categories

C257S706000, C257S713000, C257SE23039, C257S673000

Type

Reexamination Certificate

Status

active

Patent number

08049312

Description

ABSTRACT:
A semiconductor die package includes: an assembly including a semiconductor die, a clip structure attached to an upper surface of the semiconductor die, and a heat sink attached to an upper surface of the clip structure; and a molding material partially encapsulating the assembly, wherein an upper surface of the heat sink is exposed through the molding material.

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