Semiconductor device package having a connection substrate with

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

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257692, 257693, 257696, H01L 23495

Patent

active

060877162

ABSTRACT:
A semiconductor device mount structure containing a semiconductor device (10), a connection substrate (30) disposed at the lower side of the semiconductor device (10), and leads (20) which are connected to external connection terminals (12) of the semiconductor device (10) at one ends thereof, turned back and connected to wires provided on the connection substrate (30) at the other ends thereof. The connection substrate (30) is constructed by plural carrier substrates. Each of the plural carrier substrates is right-angled isosceles triangular, and the plural carrier substrates are arranged so as to form a substantially square shape at the lower portion of the semiconductor device (10).

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patent: 5789809 (1998-08-01), Joshi

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