Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-04-19
2009-06-02
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE33075, C257S675000, C257SE33057, C257S099000, C257S433000, C257S696000, C257S712000, C257S704000, C257S707000, C257S706000, C257S710000, C257S713000, C257S680000, C257S795000, C257S784000, C257S786000
Reexamination Certificate
active
07541669
ABSTRACT:
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewall interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.
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Attached are IDS's From the U.S. Appl. No. 11/015,534, filed Dec. 18, 2004 pursuant to 37 CFR 1.98(d)(1) No Copies of Cited References are Enclosed Herwith.
Carberry Patrick Joseph
Gilbert Jeffery John
Libricz, Jr. George John
Moyer Ralph Salvatore
Osenbach John William
Agere Systems Inc.
Mendelsohn Steve
Mendelsohn & Associates, P.C.
Williams Alexander O
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