Semiconductor device using film carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

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257672, 257676, 257750, 257751, 257773, 257787, 437211, 437217, 437219, H01L 2348, H01L 2156

Patent

active

053048431

ABSTRACT:
A semiconductor device, which uses a film carrier, comprises a semiconductor element with a plurality of terminals, a resin film with a first surface and a second surface, the film having a hole in which the semiconductor element is mounted, and a plurality of lead wires formed on the first surface of the resin film. Each lead wire has an inner lead, an intermediate lead and an outer lead. The inner lead is connected to a corresponding one of the terminals of the semiconductor element. The outer lead is connected to a corresponding external electrode. The intermediate lead is situated between the inner lead and the outer lead. At least said intermediate lead is formed on the first surface of the film. Each outer lead and that portion of the intermediate lead, which is close to the outer lead, is substantially on a level with the external electrode.

REFERENCES:
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4903114 (1990-02-01), Aoki et al.
patent: 4953173 (1990-08-01), Fujitsu
patent: 5021866 (1991-06-01), Sudo et al.
IBM Tech. Dis. Bul.-vol. 32, No. 10A, Mar. 1990 "Plane Electrical Enhancement".

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