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Chip scale package with direct attachment of chip to lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Chip scale package with heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Chip scale package with heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Chip support of a leadframe for an integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Chip-lead interconnection structure in a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Chip-mounted film package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Chip-packaging substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Chip-packaging with bonding options having a plurality of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Chip-stacked package structure having leadframe with...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Circuit board with auxiliary wiring configuration to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Circuit device and method of manufacture thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Circuit pattern for a ball grid array integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Circuit pattern tape for wafer-scale production of chip size...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Circuit tape having adhesive film, semiconductor device, and a m

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Clamp and heat block assembly for wire bonding a...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Clamp for pattern recognition

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Co-packaged control circuit, transistor and inverted diode

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Coated semiconductor die/leadframe assembly and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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