Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-12-13
2005-12-13
Smith, Brad (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257S678000
Reexamination Certificate
active
06975023
ABSTRACT:
A copackaged electronic device comprises a diode device having an anode coupled to a drain electrode of a switching device and a cathode capable of being coupled to an external circuit. The switching device may be controlled by an integrated circuit mounted on a source electrode of the switching device and electrically connected such that the integrated circuit is capable of controlling switching of the switching device. For example, the device is used in a power factor correction circuit. The diode device comprises at least one inverted diode having a solderable anode and a wire-bondable cathode.
REFERENCES:
patent: 5874826 (1999-02-01), Chen et al.
patent: 6335548 (2002-01-01), Roberts et al.
patent: 6740902 (2004-05-01), Oliver et al.
patent: 6747880 (2004-06-01), Grover
Oliver Stephen
Richard Hugh D.
International Rectifier Corporation
Menz Douglas M.
Ostrolenk Faber Gerb & Soffen, LLP
Smith Brad
LandOfFree
Co-packaged control circuit, transistor and inverted diode does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Co-packaged control circuit, transistor and inverted diode, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Co-packaged control circuit, transistor and inverted diode will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3517233