Circuit device and method of manufacture thereof

Details Circuit device and method of manufacture thereof Circuit device and method of manufacture thereof

2005-09-20

2005-09-20

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

C257S676000, C257S666000, C257S784000, C257S787000

Reexamination Certificate

active

06946724

ABSTRACT:
A circuit device10comprises conductive patterns11, separated by separation grooves41, circuit elements12, affixed onto conductive patterns11, and an insulating resin13, covering circuit elements12and conductive patterns11and filling separation grooves41while exposing the rear surfaces of conductive patterns11. Constricted parts19are formed at side surfaces of separation grooves41. At constricted parts19, the width of separation grooves41is made narrower than at other locations. Thus by making insulating resin13adhere closely to constricted parts19, the adhesion of insulating resin13with conductive patterns11is improved.

REFERENCES:
patent: 4942452 (1990-07-01), Kitano et al.
patent: 5157475 (1992-10-01), Yamaguchi
patent: 6143981 (2000-11-01), Glenn
patent: 2003/0178707 (2003-09-01), Abbott

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