Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-07-16
2009-11-10
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE23031, C257SE23036, C257SE23043, C257SE23047, C257SE23052, C257S686000, C257S777000, C257S723000, C257S784000, C257S786000, C257S670000, C257S666000, C361S813000
Reexamination Certificate
active
07615853
ABSTRACT:
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads arranged in rows facing each other and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips stacked together and provided on the die pad, the plurality of chips and the plurality of inner leads arranged in rows facing each other being electrically connected with each other; and an encapsulant provided to cover the chip-stacked structure and the leadframe; wherein the leadframe comprises at least a bus bar provided between the plurality of inner leads arranged in rows facing each other and the die pad, the bus bar being formed by multiple pieces.
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Shen Geng-Shin
Tu Wu-Chang
CHIPMOS Technologies (Bermuda) Ltd.
CHIPMOS Technologies Inc.
Chow Ming
Sinorica LLC
Williams Alexander O
LandOfFree
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