LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead frame for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Lead frame for semiconductor package and lead frame plating meth

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead frame for the installation of an integrated circuit in...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Lead frame for use in a resin-sealed type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Lead frame for use in a semiconductor device and a semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Lead frame for use in a semiconductor device and method of manuf

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Lead frame formed of a copper-zirconium alloy

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Lead frame free of irregular deformation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead frame having a die pad with metal foil layers attached to t

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Lead frame having a die stage smaller than a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension

Lead frame having a lead with a non-uniform width

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Lead frame having a Ni-Mn alloy layer and a Pd layer

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Lead frame having a plurality of island regions and a suspension

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Lead frame having a supporting pad with a plurality of slits arr

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Lead frame having an anodic oxide film coating

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Lead frame having an outlet with a larger cross sectional area t

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead frame having cut-out wing leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Lead frame having deflectable and thereby precisely removed tie

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead frame having deformable supports