Lead frame free of irregular deformation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257670, 257667, H01L 23495

Patent

active

057639426

ABSTRACT:
There is provided a lead frame including an outer frame, a die pad on which a semiconductor device is to be mounted, a plurality of outer leads extending from the outer frame to the die pad, a dam bar connected at opposite ends thereof to the outer frame for connecting the outer leads to one another for prevention of resin overflow, and a support lead extending obliquely to the dam bar for connecting the die pad to the outer frame. The outer frame is formed beyond an end of the dam bar with an opening extending in a direction making an angle with a direction in which the dam bar longitudinally extends so that there is formed an elastically deformable portion between the opening and an end of the dam bar, the opening having a length covering at least a width of the dam bar. When there is generated a stress because of shrinkage of resin with which a semiconductor device is sealed, the elastically deformable portion is first deformed by absorbing a stress to thereby prevent the stress from spreading further to the dam bar. Thus, it is possible to prevent irregular bending of outer leads connected by the dam bar with each other. As a result, higher accuracy is expected with respect to a position of outer leads after a semiconductor device is sealed with resin.

REFERENCES:
patent: 5223738 (1993-06-01), Okada
patent: 5293064 (1994-03-01), Yoshimoto et al.
patent: 5309010 (1994-05-01), Shibata et al.
patent: 5541447 (1996-07-01), Maejima et al.
patent: 5554885 (1996-09-01), Yamasaki et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lead frame free of irregular deformation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame free of irregular deformation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame free of irregular deformation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2203603

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.