Lead frame having a Ni-Mn alloy layer and a Pd layer

Details Lead frame having a Ni-Mn alloy layer and a Pd layer Lead frame having a Ni-Mn alloy layer and a Pd layer

1998-05-19

1999-11-02

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

257666, 257758, 257766, 257769, 257783, H01L 2348, H01L 2352, H01L 2334, H01L 2952

Patent

active

059776200

ABSTRACT:
A method for manufacturing a lead frame includes degreasing and activating the surface of a metal sheet, providing the plating solution containing nickel(II) sulfamate tetrahydrate, (Ni(H.sub.2 NSO.sub.3).sub.2.4H.sub.2 O), manganese(II) sulfamate tetrahydrate (Mn(H.sub.2 NSO.sub.3).sub.2.4H.sub.2), nickel (II) chloride hexahydrate (NiCl.sub.2.6H.sub.2 O) and boric acid, plating the metal sheet in the plating solution to form a Ni--Mn alloy layer, and forming a Pd or Pd alloy layer on the Ni--Mn alloy layer.

REFERENCES:
patent: 4517584 (1985-05-01), Matsushita et al.
patent: 4845543 (1989-07-01), Okikawa et al.
patent: 5019891 (1991-05-01), Onuki et al.
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5629559 (1997-05-01), Miyahara

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