Lead frame having an outlet with a larger cross sectional area t

Details Lead frame having an outlet with a larger cross sectional area t Lead frame having an outlet with a larger cross sectional area t

1992-08-27

1994-03-08

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257666, 257787, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

052930653

ABSTRACT:
A lead frame (10) is connected to an integrated circuit (32) by adhesives. The lead frame (10) includes a mold gate (40) to provide for constant flow of resin (72) into the mold cavity (66) during encapsulation of the integrated circuit (32). The lead frame (10) also has an air vent (50) to direct air and any excess resin (74) from the mold cavity (66) to a dummy cavity (70).

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4894704 (1990-01-01), Endo
patent: 4916519 (1990-04-01), Ward
patent: 4965654 (1990-10-01), Karner et al.
William C. Ward, "Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-ns 1-Mblr Dram Chip by Area Wire Bond Techniques", 1988 IEEE, pp. 552-557.

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