Lead frame for semiconductor package and lead frame plating meth

Details Lead frame for semiconductor package and lead frame plating meth Lead frame for semiconductor package and lead frame plating meth

1999-03-02

2000-11-21

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

257769, 257762, H01L 23495

Patent

active

06150713&

ABSTRACT:
A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate.

REFERENCES:
patent: 5510197 (1996-04-01), Takahashi et al.
patent: 5650661 (1997-07-01), Mathew
patent: 5760468 (1998-06-01), King et al.
patent: 5767574 (1998-06-01), Kim et al.
patent: 5801436 (1998-09-01), Serizawa
patent: 5914532 (1999-06-01), Akagi et al.
patent: 5977620 (1999-11-01), Kim et al.
patent: 5994767 (1999-11-01), Huang et al.
patent: 6034422 (2000-03-01), Horita et al.
patent: 6037653 (2000-03-01), Kinm et al.

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