Lead frame for use in a resin-sealed type semiconductor device

Details Lead frame for use in a resin-sealed type semiconductor device Lead frame for use in a resin-sealed type semiconductor device

1995-09-13

1997-11-04

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257669, 257787, 437217, 437219, H01L 23495, H01L 2328

Patent

active

056843275

ABSTRACT:
A lead frame for use in a resin-sealed type semiconductor device, comprising an outer frame, a plurality of leads supported by the outer frame, arranged side by side and each composed of an inner lead and an outer lead, a die pad arranged inside the outer frame and located so that the tips of the inner leads are close to the die pad and oppose the die pad, and a resin flow-control body. The resin flow-control body has been formed by extending a portion of the outer frame toward the die pad through a space formed in the outer frame. The body is designed to be placed in a cavity of a mold having a gate communicating with the cavity, with the space located between the gate and the cavity, in order to form a resin sealing body.

REFERENCES:
patent: 4556896 (1985-12-01), Meddles
patent: 4894704 (1990-01-01), Endo
patent: 5293065 (1994-03-01), Chan
patent: 5371044 (1994-12-01), Yoshida et al.
patent: 5517056 (1996-05-01), Bigler et al.

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