Lead frame having an anodic oxide film coating

Details Lead frame having an anodic oxide film coating Lead frame having an anodic oxide film coating

1991-10-15

1993-10-12

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257675, 257781, 257782, 257783, 257798, 257746, 257794, H01L 2348, H01L 2944, H01L 3902, H01L 2946

Patent

active

052528553

ABSTRACT:
Lead frames, in which at least one part of the surface of a metal member which is a part of the lead frame is provided with an anodic oxide film of copper or a copper alloy, and in which a member composed substantially of a resin film or a resin plate is connected to the lead frame through this anodic oxide film by gluing or pressing under heat exhibit good adhesion between the metal member and the resin film or plate. Similarly, lead frames constructed with at least two metal members, having a portion of the surface provided with an anodic oxide film of copper or a copper alloy, and in which these metal members are joined together through this anodic oxide film exhibit good adhesion between the metal members.

REFERENCES:
patent: 4248675 (1981-02-01), Bozler et al.

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