Lead frame having a lead with a non-uniform width

Details Lead frame having a lead with a non-uniform width Lead frame having a lead with a non-uniform width

2007-12-04

2007-12-04

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With means for controlling lead tension

C257S671000, C257S672000, C257S676000, C257SE23034, C257SE23043, C257SE23049

Reexamination Certificate

active

11106514

ABSTRACT:
A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width that is smaller than the width of another portion of the lead. A plating layer may be provided on the attaching portion. The lead frame may be implemented in a semiconductor package.

REFERENCES:
patent: 5386625 (1995-02-01), Tsukamoto
patent: 5988707 (1999-11-01), Abe et al.
patent: 6037652 (2000-03-01), Matsutomo
patent: 6448633 (2002-09-01), Yee et al.
patent: 6797540 (2004-09-01), Li et al.
patent: 6956282 (2005-10-01), Alvarez et al.
patent: 7064419 (2006-06-01), Bayan et al.
patent: 2002/0121670 (2002-09-01), Minamio et al.
patent: 2004/0145043 (2004-07-01), Hayashi et al.
patent: 2006/0006523 (2006-01-01), Coyle et al.
patent: 09-148520 (1997-06-01), None
patent: 10-163410 (1998-06-01), None

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