Lead frame having deformable supports

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257670, 257674, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053090187

ABSTRACT:
A lead frame has a die pad with an array of surrounding leads connected at their sides by tie bars and at their ends by coupling bars which are connected through narrow supports to surrounding side rails or partition frames. Positioning holes are provided as positioning references in the coupling bars when the coupling parts of the leads such as the tie bars are removed to separate the leads from the lead frame.

REFERENCES:
patent: 4870474 (1989-09-01), Karashima
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5223738 (1993-06-01), Okada et al.

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