Lead frame having cut-out wing leads

Details Lead frame having cut-out wing leads Lead frame having cut-out wing leads

1995-10-27

1997-04-22

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257672, 257674, H01L 23495

Patent

active

056231628

ABSTRACT:
In a remote tie-bar lead frame 10 rising an island 4 for bearing a semiconductor chip, one pair of hanger pins 1 for supporting the island 4, a number of outwardly extending leads 2 located to surround the island 4 separately from the island 4, and a pair of tie-bars 6 for mutually tying the leads so as to prevent a flow-out of a resin when a resin packaging is carried out, one pair of wing leads 3A outwardly extend from a pair of opposite sides of the island 4 orthogonal to the pair of opposite sides from which the hanger pins 1 extends. Each of the wing leads 3A extends between a pair of adjacent leads, but terminates to slightly outwardly project from a mold line 5.

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