Lead frame having a die stage smaller than a semiconductor...

Details Lead frame having a die stage smaller than a semiconductor... Lead frame having a die stage smaller than a semiconductor...

2011-06-21

2011-06-21

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23037

Reexamination Certificate

active

07964942

ABSTRACT:
A lead frame has a die stage for mounting a semiconductor chip whose electrodes are electrically connected with leads via bonding wires, wherein they are enclosed in a molded resin, thus producing a semiconductor device. The outline of the die stage is shaped so as to be smaller than the outline of the semiconductor chip, and a plurality of cutouts are formed in the peripheral portion of the die stage so as to reduce the overall area of the die stage and to enhance the adhesion between the die stage and molded resin. The length L2of each cutout ranges from (L1×0.05) to (L1×0.20) where L1denotes the length of each side of the die stage, and the overall area S2of the die stage ranges from (S1×0.10) to (S1×0.40) where S1denotes the overall area of the semiconductor chip.

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