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Interposer connecting leadframe and integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Interposer for separating stacked semiconductor chips...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Interposer including adhesive tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Interposer substrates with reinforced interconnect slots,...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Interposers having encapsulant fill control features

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Inverted J-lead for power devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Large die package and method for the fabrication thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Large die package structures and fabrication method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Large die package structures and fabrication method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Laser diode and heatsink quick connect/disconnect assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Laser diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Laser diode packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Laser diode packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Laterally situated stress/strain relieving lead for a semiconduc

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Laterally situated stress/strain relieving lead for a...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Layered lead structures

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate

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Lead configuration for inline packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Lead end grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Lead finger immobilization apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Lead finger tread for a semiconductor lead package system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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