Interposer connecting leadframe and integrated circuit

Details Interposer connecting leadframe and integrated circuit Interposer connecting leadframe and integrated circuit

1995-08-31

1996-10-29

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257673, 257692, 257737, 257792, 257779, 257786, H01L 2328, H01L 2348

Patent

active

055699561

ABSTRACT:
An interposer between the leads of a leadframe and the ends of wires connected to an integrated circuit die is described herein. The interposer may consist a polyimide tape or other insulating material with conductive traces formed thereon, each trace electrically connecting an inner bonding pad to an outer bonding pad formed on the tape. The outer bonding pads are generally arranged around the periphery of the interposer and are bonded to respective ends of the leadframe. An integrated circuit die is placed in approximately the center of the interposer surrounded by the inner bonding pads. An automatic bonder then bonds wires to the bonding pads on the die and to the inner bonding pads on the interposer. The die is now electrically connected to the leadframe via the traces on the interposer.

REFERENCES:
patent: 4417386 (1983-11-01), Exner
patent: 5018005 (1991-05-01), Lin et al.
patent: 5182631 (1993-01-01), Tomimuro et al.
patent: 5231303 (1993-07-01), Kasahara et al.
patent: 5233131 (1993-08-01), Liang et al.
patent: 5260168 (1993-11-01), Vernon
patent: 5442231 (1995-08-01), Miyamoto et al.
patent: 5457340 (1995-10-01), Templeton, Jr. et al.

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