Laser diode package

Details Laser diode package Laser diode package

1998-06-25

1999-12-28

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257678, 257698, 257670, H01L 23495, H01L 2302

Patent

active

060085290

ABSTRACT:
A surface mount semiconductor laser diode package has a substrate on which the laser diode is mounted. The top electrode of the laser diode is wire-bonded to the top end of a plated-through conduit through the substrate, and the bottom end of the plated-through conduit is connected to a circuit contact plated at the bottom surface of the substrate. The bottom electrode of the laser diode is flip-chip mounted to the top end of another plated-through conduit, and bottom end of the second plated-through conduit is connected to a second circuit contact. Each laser diode is covered with a transparent lid or a lid with a lens. For mass production, a large number of the laser diodes arranged in a matrix formation are mounted on a common substrate. Walls are erected around each laser diode. A transparent cover is placed over the walls. All the plated-through conduits at the edges of the laser diodes in a same column are aligned and sawed through together.

REFERENCES:
patent: 5220195 (1993-06-01), McShane et al.
patent: 5629952 (1997-05-01), Bartholomew et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5767528 (1998-06-01), Suni et al.
patent: 5773879 (1998-06-01), Fusayasu et al.

Affiliated with

Also associated with

Rating

Laser diode package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser diode package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser diode package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2384104