Lead end grid array semiconductor package

Details Lead end grid array semiconductor package Lead end grid array semiconductor package

1996-12-31

1999-02-02

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257692, 257778, 257787, H01L 23495

Patent

active

058669396

ABSTRACT:
The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length forming a lead end grid array semiconductor package. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at least one identical plane direction-converting lead part is formed by at least one bending part, whereby the lead ends are distributed in a grid array. The invention includes a lead end grid array semiconductor package employing the grid array type lead frame, which is as small as or similar to that of semiconductor chip in area while the lead ends are arrayed on one plane, farther distant way from neighboring ones but in a higher number per area, in such a manner that they form a grid array.

REFERENCES:
patent: 5363279 (1994-11-01), Cha
patent: 5428248 (1995-06-01), Cha
patent: 5436492 (1995-07-01), Yamanaka
patent: 5519251 (1996-05-01), Sato et al.
patent: 5684330 (1997-11-01), Lee
Japanese Publication No. 94-53399 entitled "Resin-Sealed Semiconductor Device" (abstract only).
Japanese Publication No. 94-97349 entitled "Resin-Sealed Semiconductor Device and Production Thereof" (abstract only).
Japanese Publication No. 93-252585 entitled "IC Module" (abstract only).

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