Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate
2006-09-05
2006-09-05
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
C257S668000, C257S667000, C257S680000, C257S774000, C257S786000, C257S784000, C257S773000, C257S782000, C257S783000, C257S780000, C428S209000, C428S131000, C174S255000, C361S688000, C361S711000, C361S712000, C361S737000, C029S830000, C029S852000, C029S846000
Reexamination Certificate
active
07102217
ABSTRACT:
A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical attachment, as by wire bonding, to conductive traces on the opposite side of the interposer substrate. One or more reinforcements in the form of crosspieces or bridges span and segment intermediate portions of the substrate slot to resist bending stresses acting in the slot region proximate the centerline of the interposer substrate tending to crack or delaminate a polymer wire bond mold cap filling and covering the slot and the wire bonds. Various interposer substrate configurations are also disclosed, as are methods of fabrication.
REFERENCES:
patent: 3635124 (1972-01-01), Parsons
patent: 5231878 (1993-08-01), Zanini-Fisher et al.
patent: 5313096 (1994-05-01), Eide
patent: 5384689 (1995-01-01), Shen
patent: 5514905 (1996-05-01), Sakuta et al.
patent: 5567655 (1996-10-01), Rostoker et al.
patent: 5589420 (1996-12-01), Russell
patent: 5597643 (1997-01-01), Weber
patent: 5661336 (1997-08-01), Phelps, Jr. et al.
patent: 5723907 (1998-03-01), Akram
patent: 5739585 (1998-04-01), Akram et al.
patent: 5818698 (1998-10-01), Corisis
patent: 6078104 (2000-06-01), Sakurai
patent: 6091140 (2000-07-01), Toh et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6177723 (2001-01-01), Eng et al.
patent: 6190943 (2001-02-01), Lee et al.
patent: 6300165 (2001-10-01), Castro
patent: 6303948 (2001-10-01), Kudou et al.
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6370767 (2002-04-01), Solberg et al.
patent: 6531335 (2003-03-01), Grigg
patent: 6531785 (2003-03-01), Shimizu et al.
patent: 6700983 (2004-03-01), Bøgeskov-Jensen et al.
patent: 6720666 (2004-04-01), Lim et al.
patent: 6740983 (2004-05-01), Tay et al.
patent: 6781248 (2004-08-01), Hui et al.
patent: 2001/0012643 (2001-08-01), Asada
patent: 2002/0008307 (2002-01-01), Dickey
patent: 2002/0020689 (2002-02-01), Leung
patent: 2002/0072148 (2002-06-01), Chen
patent: 2002/0172024 (2002-11-01), Hui et al.
patent: 2003/0132518 (2003-07-01), Castro
patent: 4-142095 (1992-05-01), None
patent: 10-308467 (1998-11-01), None
TraskBritt
Williams Alexander Oscar
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