Laterally situated stress/strain relieving lead for a semiconduc

Details Laterally situated stress/strain relieving lead for a semiconduc Laterally situated stress/strain relieving lead for a semiconduc

1996-09-06

1998-10-13

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257786, 257692, 257773, H01L 23495, H01L 2348, H01L 2352, H01L 2302

Patent

active

058216081

ABSTRACT:
A semiconductor chip package includes a substrate having a first surface and a second surface and a gap extending from the first surface to the second surface. The substrate defines a plane which is substantially parallel to the first and second surfaces. The substrate has conductive terminals accessible and the second surface and bond pads. Conductive leads extend across the gap whereby each lead electrically interconnects one of the conductive terminals and one of the bond pads. Each lead includes an expansion section within the gap which is laterally curved with respect to the plane. A semiconductor chip having a back surface and a face surface is assembled to the substrate. The face surface includes a plurality of contacts on the periphery of the face surface of the chip whereby the chip contracts are electrically connected to the bond pads on the substrate.

REFERENCES:
patent: 4642889 (1987-02-01), Grabbe
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5316788 (1994-05-01), Dibble et al.
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5536909 (1996-07-01), DiStefano et al.
patent: 5581122 (1996-12-01), Chao et al.
patent: 5640048 (1997-06-01), Selna
patent: 5646828 (1997-07-01), Degani et al.
patent: 5663593 (1997-09-01), Mostafazadeh et al.

Affiliated with

Also associated with

Rating

Laterally situated stress/strain relieving lead for a semiconduc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laterally situated stress/strain relieving lead for a semiconduc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laterally situated stress/strain relieving lead for a semiconduc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-315519