Large die package structures and fabrication method therefor

Details Large die package structures and fabrication method therefor Large die package structures and fabrication method therefor

2006-10-31

2006-10-31

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C438S123000

Reexamination Certificate

active

07129569

ABSTRACT:
A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.

REFERENCES:
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5550087 (1996-08-01), Brossart
patent: 5886405 (1999-03-01), Kim et al.

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