Large die package and method for the fabrication thereof

Details Large die package and method for the fabrication thereof Large die package and method for the fabrication thereof

2007-11-20

2007-11-20

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257S787000, C257SE23031, C257SE23037, C257SE23049, C438S123000

Reexamination Certificate

active

11126052

ABSTRACT:
A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a portion of the paddle and at least a portion of the leads of the lead-frame. The interposer is insulated from the leads. A die is attached to the interposer.

REFERENCES:
patent: 6638790 (2003-10-01), Minamio et al.
patent: 6825062 (2004-11-01), Yee et al.
patent: 6825249 (2004-11-01), Takeda et al.
patent: 2003/0001252 (2003-01-01), Ku et al.
patent: 2004/0262718 (2004-12-01), Ramakrishna
patent: 2005/0156292 (2005-07-01), Paek

Affiliated with

Also associated with

Rating

Large die package and method for the fabrication thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Large die package and method for the fabrication thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Large die package and method for the fabrication thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3819715