Interposer including adhesive tape

Details Interposer including adhesive tape Interposer including adhesive tape

2006-07-11

2006-07-11

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S690000, C257S737000, C257S783000, C257SE23014, C361S813000, C438S118000, C438S123000

Reexamination Certificate

active

07075173

ABSTRACT:
Two dice may be provided within a single package so that one pin and associated leadfinger may be coupled to bond pads on different dice. This may mean that two different bond pads on different dice are coupled, for example by wirebonding, to the same leadfinger. An adhesive tape may be secured so as to bridge the two dice. One or more conductive traces are formed on the upper side of the adhesive tape and adhesive is provided on the other side to secure the tape to the two dice. As a result, wire bonds may be made from a pad on one die to a trace and then from the opposite side of the trace to a leadfinger. At the same time, a wire bond may be made from a pad on the other die to the same leadfinger. In another embodiment, an adhesive tape with a conductive trace on it may be used as a wire bond bridge to join spaced bond pads on a single chip.

REFERENCES:
patent: 6104084 (2000-08-01), Ishio et al.
patent: 6453547 (2002-09-01), Yang
patent: 6580160 (2003-06-01), Yang
patent: 6768187 (2004-07-01), Yang
patent: 6909167 (2005-06-01), Yang

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