Lead finger immobilization apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Patent

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Details

257666, 257701, H01L 23495, H01L 23053

Patent

active

059527110

ABSTRACT:
A lead finger immobilization apparatus is disclosed. The apparatus utilizes a perforated layer of a nonconductive material.

REFERENCES:
patent: 5554885 (1996-09-01), Yamasaki et al.

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