Lead finger tread for a semiconductor lead package system

Details Lead finger tread for a semiconductor lead package system Lead finger tread for a semiconductor lead package system

1994-08-04

1996-09-24

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257692, 257739, H01L 2348

Patent

active

055593666

ABSTRACT:
A lead finger of a lead frame in a lead package system for a semiconductor die includes a tread on a surface of the lead finger for increasing adhesion between the finger and an adhesive tape, the tape communicating between the tread and the die. The tread substantially minimizes lead finger bounce upon wire bonding the lead finger with the die. The tread is patterned to provide optimum surface area for adhesion with the adhesive tape. The tread includes a groove and/or cavity stamped or etched on the surface of the lead finger.

REFERENCES:
patent: 4862246 (1989-08-01), Masuda
patent: 5358906 (1994-10-01), Lee

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