LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Downset lead frame for semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Drop resistant bumpers for fully molded memory cards

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Drop-in heat sink package with window frame flag

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Drop-mold conformable material as an encapsulation for an...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Dual channel small outline optocoupler package and method thereo

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Dual chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Dual gauge leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Dual leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Dual LOC semiconductor assembly employing floating lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Dual row leadframe and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Dual row leadframe and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Dual side cooling integrated power device package and module...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Dual sided integrated circuit chip package with offset wire bond

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Dual-chip integrated circuit package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Dual-chip integrated circuit package with a chip-die pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Dual-chip integrated circuit package with unaligned chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Dual-die integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Duel die package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Edge connectable metal package