Drop resistant bumpers for fully molded memory cards

Details Drop resistant bumpers for fully molded memory cards Drop resistant bumpers for fully molded memory cards

2003-06-26

2009-02-03

Nadav, Ori (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S667000, C257S670000, C257S773000, C257S775000

Reexamination Certificate

active

07485952

ABSTRACT:
A memory card comprising a leadframe having a plurality of contacts, at least one die pad, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. Also included in the leadframe are at least two bumpers. Attached to the die pad is a semiconductor die which is electrically connected to at least one of the traces. A body defining at least two corner regions at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body, and the bumpers are located at respective ones of the corner regions thereof.

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