Dual channel small outline optocoupler package and method thereo

Details Dual channel small outline optocoupler package and method thereo Dual channel small outline optocoupler package and method thereo

1994-08-31

1996-02-06

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257 82, 250551, H01L 2715, H01L 23495, G02B 2700

Patent

active

054898005

ABSTRACT:
A leadframe (10) architecture provides placement of multiple optocoupler pair devices (45, 50) in a minimum size footprint package. A detector flag (20) and LED flag (12) are placed on a common centerline (26) within the footprint. A critical length is determined for packaging factors lying along the centerline. The angle (28) formed between the centerline and the longitudinal axis (24) controls the optocoupler pair fit within the package. The angle (28) is calculated by taking the arc-sine function of the critical length divided by the footprint width.

REFERENCES:
patent: 4307297 (1981-12-01), Groff et al.
patent: 4794431 (1988-12-01), Park
patent: 5237205 (1993-08-01), Newman

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