Drop-mold conformable material as an encapsulation for an...

Details Drop-mold conformable material as an encapsulation for an... Drop-mold conformable material as an encapsulation for an...

2008-09-03

2010-11-16

Pham, Hoai V (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S687000, C257SE23060

Reexamination Certificate

active

07834430

ABSTRACT:
An integrated circuit package system includes: providing an integrated circuit; mounting a lead on the periphery of the integrated circuit; connecting the integrated circuit to the lead with an interconnect; and forming a conformable material by pressing the conformable material on the integrated circuit, the lead, and the interconnect.

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