LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die attach region for use in a micro-array integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die package with asymmetric leadframe connection

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Die pad for semiconductor packages and methods of making and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die pad structure for solder bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die paddle clamping for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die power distribution system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die size-increasing integrated circuit leads and thermally...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Direct attachment of semiconductor chip to organic substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Direct contact leadless package for high current devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Display driver integrated circuit and flexible wiring board...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Dissimilar adhesive die attach for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Double downset double dambar suspended leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Double-sided thermally enhanced IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Down-bonded lead-on-chip type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Downset exposed die mount pad leadframe and package