Die package with asymmetric leadframe connection

Details Die package with asymmetric leadframe connection Die package with asymmetric leadframe connection

2008-05-20

2008-05-20

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000

Reexamination Certificate

active

07375415

ABSTRACT:
A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.

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