Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1992-06-26
1994-04-19
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257666, 257669, 257674, 257676, 257691, 257207, 257208, 257212, 257220, 437915, H01L 2348, H01L 2944, H01L 2156, H01L 2158
Patent
active
053048423
ABSTRACT:
A semiconductor assembly comprises a semiconductor die which is attached by a carrier material to a lead frame. The carrier material is coated on the die side with one type of adhesive and on the lead frame side with a different adhesive. The lead frame has a small surface area to connect to the carrier material, while the semiconductor die has a large surface area to connect to the carrier material. As used with one inventive embodiment, the adhesive between the die and the carrier softens at a low temperature preventing the die from cracking at elevated temperatures. The adhesive on the lead frame side of the carrier material softens at a higher temperature than the adhesive of the die side of the adhesive, thereby firmly connecting the lead frame having a small surface area to the carrier.
REFERENCES:
patent: 3711625 (1973-01-01), Dupuis
patent: 4012835 (1977-03-01), Wallick
patent: 4687693 (1987-08-01), Sheyon et al.
patent: 4761335 (1988-08-01), Aurichio et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4882298 (1989-11-01), Moeller et al.
patent: 4916519 (1990-04-01), Ward
patent: 4924291 (1990-05-01), Lesk et al.
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4949160 (1990-08-01), Ohno et al.
patent: 5042919 (1991-08-01), Yabu et al.
patent: 5062565 (1991-11-01), Wood et al.
Farnworth Warren M.
Moden Walter L.
Smith Rockwell D.
Crane Sara W.
Jr. Carl Whitehead
Martin Kevin D.
Micro)n Technology, Inc.
Protigal Stanley N.
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