Down-bonded lead-on-chip type semiconductor device

Details Down-bonded lead-on-chip type semiconductor device Down-bonded lead-on-chip type semiconductor device

1993-12-10

1995-06-27

Larkins, William D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257668, 257664, 257666, 257691, H01L 2348, H01L 2940, H01L 2302, H01L 2312

Patent

active

054282470

ABSTRACT:
Disclosed is a semiconductor device wherein the down bonding and the mounting of multi-pin is made possible. A conductive member adhered to the bottom surface of the semiconductor element. The conductive member and the specific pad of the semiconductor element are connected by the connecting member, which enables the entire bottom surface of the semiconductor element to be used for down bonding. Further, the more effective latch-up suppression, noise dispersion and speed improvement compared with the conventional LOC-type package structure is possible.

REFERENCES:
patent: 4567643 (1986-02-01), Droguet et al.
patent: 5175397 (1992-12-01), Lindberg
patent: 5208188 (1993-05-01), Newman
patent: 5220195 (1993-06-01), McShane et al.
patent: 5252854 (1993-10-01), Arita et al.

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